发明名称 VORRICHTUNG ZUM VERKLEBEN VON SUBSTRATEN
摘要 In order to ensure simultaneous rotation of two substrates during boding in a simple and economical manner, the invention provides a device for bonding two substrates having one inner hole to a substrate disc. Said device comprises a first holding device (55) to hold the first substrate, a centering pin that is connected in a rotationally fixed manner to the first holding device (84) and that can be inserted into the inner hole of at least the first substrate, in addition to a drive mechanism for rotating the centering pin (1) and the first holding device. The invention is characterized by a driver (20) that can be engaged with the centering pin (1) and a second holding device to hold the second substrate, which is connected to the driver (20) in a rotationally fixed manner.
申请公布号 DE50208280(D1) 申请公布日期 2006.11.09
申请号 DE2002508280 申请日期 2002.05.02
申请人 STEAG HAMATECH AG 发明人 LEONHARDT, STEPHAN;GUECLUE, ILHAN;WINTER, MARC
分类号 G11B7/26;B29C65/48;G11B7/24 主分类号 G11B7/26
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