发明名称 |
COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF |
摘要 |
<p>Provided is a composite which is satisfactorily excellent in the reliability with respect to adhesiveness, and also can satisfactorily inhibit the occurrence of a resin powder or a fluff of a fiber or the like which has a possibility of dropping. A composite (100) which comprises a fiber sheet (101) impregnated with a resin composition (102), wherein a cured article from the resin composition (102) has a storage modulus of 100 to 2000 MPa at 20°C. The composite (100) may have a through hole (103).</p> |
申请公布号 |
WO2006118059(A1) |
申请公布日期 |
2006.11.09 |
申请号 |
WO2006JP308458 |
申请日期 |
2006.04.21 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;TAKANO, NOZOMU;KAMIYA, MASAKI |
发明人 |
TAKANO, NOZOMU;KAMIYA, MASAKI |
分类号 |
C08J5/24;B32B15/08;C08G59/20;C08L101/00;H05K3/46 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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