| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a solid-state imaging device which can secure a moisture resistance, and also a method for manufacturing the package for the solid-state imaging device. <P>SOLUTION: The package for the solid-state imaging device has a solid-state imaging device; and a package container which has a recess for accommodation of the solid-state imaging device formed therein, and which has the imaging device fixed to the bottom surface of the recess with a die bonding agent. A groove is provided in the periphery of a die attach where the imaging device at the bottom surface is fixed, and a drying member is accommodated in the groove. <P>COPYRIGHT: (C)2007,JPO&INPIT |
