| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that, since the ceramic layer 1A of the part of a cavity 1D is thin and weak in a strength in a conventional ceramic multilayer substrate with cavity shown in FIG. 6 and, moreover, a second front side mounted part 2B is mounted in the top surface of the ceramic multilayer substrate 1 so that it may reach about the cavity 1D, a stress concentration acts on a joint around the second front surface mounted part 2B when it is iteratively attacked by shocks, such as falling, etc. when the ceramic multilayer substrate with the cavity is used for a portable electronic apparatus, such as, for example, a cellular phone, and a matter of being easy to generate a crack K in the cavity 1D at the ceramic layer 1A corresponding part as shown in FIG. 6. <P>SOLUTION: In the ceramic multilayer substrate 10 with the cavity, a recess 11D is formed in the cavity C opposite to the top surface 11C of the ceramic multilayer substrate 11, and a resin layer 12 overlying the recess 11D is provided on the top surface 11C, and the top surface of the resin layer 12 is formed evenly. <P>COPYRIGHT: (C)2007,JPO&INPIT |
