发明名称 RESIN COMPOSITION FOR RESIST INK
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resin composition for a resist ink, which is excellent in flexibility, shows a high UV-sensitivity, is excellent in tacking property after pre-drying, shows a good alkali developability and shows a good balance among various properties such as solder-heat resistance, chemical resistance and solvent resistance after heat curing. <P>SOLUTION: The resin composition for the resist ink contains an active energy radiation-curing resin, a dilutant, a photopolymerization initiator and a thermally reactive hardener, wherein the active energy radiation-curing resin is a resin (A) obtained by reacting an acid pendant epoxy vinyl ester compound (III) with a radically polymerizable unsaturated monomer containing an epoxy group. Here, the acid pendant epoxy vinyl ester compound (III) is obtained by reacting a polybasic acid anhydride with an epoxy vinyl ester compound (II) obtained through polyaddition of a polyfunctional epoxy resin to a half ester compound (I) obtained by reacting a compound having at least one unsaturated double bond and at least one alcoholic hydroxyl group within a molecule with a polybasic acid anhydride. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006307021(A) 申请公布日期 2006.11.09
申请号 JP20050131631 申请日期 2005.04.28
申请人 DAINIPPON INK & CHEM INC 发明人 MURATA YOSHIAKI;ITO HIRONOBU
分类号 C09D11/00;H05K3/28 主分类号 C09D11/00
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