发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device which achieves nano level machining accuracy and is structured so as not to degrade rotational accuracy even if reducer or drive motor is connected to a bearing. SOLUTION: This polishing device is to polish the R-shaped polishing section 1a of a polishing subject 1 which has an R-shaped polishing section 1a held in a polishing subject holder 2 by abutting it on a polish section 3, while swinging it. As a power transmission section 5, which is connected to a rotary drive shaft 18 of a driving source 4 for swinging the polishing subject holder 2 and the polishing subject holder 2 to transmit rotary driving force of the driving source 4 to the polishing subject holder 2, the device contains connecting sections 5a, 5b connected with the rotary drive shaft 18 and connected with the polishing subject holder 2 in non-contact state with the holder 2. The non-contact section of these connecting sections 5a, 5b are filled with pressure feed gas and are connected with the polishing subject holder 2 in non-contact state. The power transmission section 5 comprises those connecting sections 5a, 5b for transmitting rotary driving force of the driving source 4 to the polishing subject holder 2 via the rotary drive shaft 18. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305696(A) 申请公布日期 2006.11.09
申请号 JP20050133482 申请日期 2005.04.28
申请人 KENSEISHA:KK 发明人 TAKANO YASUO
分类号 B24B47/12;B24B3/34 主分类号 B24B47/12
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