| 摘要 |
PROBLEM TO BE SOLVED: To prevent a spatter from having an adverse effect on a circuit board without providing additional portions and components. SOLUTION: An electronic component module 1 comprises: the circuit board 20, a heat sink 11 for cooling the heat of the circuit board 20, and an electronic component 30 to be welded to another component. The circuit board 20 and the electronic component 30 are so arranged that the heat sink 11 prevents the spatter during welding from affecting the circuit board 20. COPYRIGHT: (C)2007,JPO&INPIT |
