| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component reducing occurrence probability of delamination and having a cavity with high dimensional precision. <P>SOLUTION: The method includes a process for forming a plurality of ceramic green sheets 4 on a support 1, by forming a first ceramic green sheet 2 having a variation ratio in a direction of a plane of 0.3 to 0.8% in a test of loading 0.5 MPa while heating at a temperature of 35 to 100°C, and by forming a second ceramic green sheet 3 on the first ceramic green sheet 2; a process for forming openings in green sheets of a part of the plurality of ceramic green sheets 4; a process for forming conductor layers 5 on the ceramic green sheets 4; and a process for burning after forming a ceramic sheet layered product 6 having cavities by laminating the plurality of ceramic green sheets provided with conductor layers so as to arrange a layer having the opening on a top of layers and by heating. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
