发明名称 COOLING APPARATUS FOR ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cooling apparatus for electronic equipment capable of efficiently cooling first and second heat-generating elements, even if the apparatus has an arrangement in which the first and second heat-generating elements are provided and a second heat pipe passes near the first heat-generating element. <P>SOLUTION: The cooling apparatus for electronic equipment is provided with a heat-generating plate 3 in which a plurality of heat-generating elements 1, 2 each separately arranged are thermally coupled to a first surface; a plurality of heat pipes 11, 12 of the number corresponding to the number of the heat-generating elements 1, 2 in which a first end is thermally connected to a second surface of the heat-receiving plate 3, to transfer the heat of the heat-generating elements 1, 2 to second ends of each of the heat pipes 2; a heat dissipation fin 4 thermally coupled to the second ends of the heat pipes 11, 12; and a thermally insulating means for insulating the transfer of heat between the heat pipes 11, 12 and the heat-generating elements 1, 2 not corresponding to the heat pipes. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006310740(A) 申请公布日期 2006.11.09
申请号 JP20050300347 申请日期 2005.10.14
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 YAMADA YUTAKA
分类号 H05K7/20;H01L23/427 主分类号 H05K7/20
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