| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrooptical apparatus capable of preventing the breakage of a terminal on a substrate side connected to the terminal of an electronic component, a method for manufacturing the electrooptical apparatus, a packaging structure, and electronic equipment equipped with the electrooptical apparatus. SOLUTION: A circuit board 3 is provided with apertures 25a, 25c, and 25d in positions corresponding to the angle portions of a semiconductor element 23 and near the semiconductor element 23 and therefore, when such a force as to bend unpackaged portions acts on the portion packaged with the semiconductor element 23 of, for example, the circuit board 3, and when the circuit board 3 bends accordingly, the stress by the circuit board 3 due to the bending is parted by the aperture 25a etc., so as not to be transferred to the terminal 27a etc., near the angle portions of, for example, the semiconductor element 23, thereby making the circuit board 3 easily bendable by the aperture 25a etc. The force is thus prevented from acting on the arrayed terminal 27 and the breakage of the terminal 17 can be prevented. COPYRIGHT: (C)2007,JPO&INPIT
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