| 摘要 |
PROBLEM TO BE SOLVED: To provide a simplified probe card that can improve high frequency characteristics and is constituted without using a coaxial probe needle used conventionally in order to inspect the electric characteristic of a wafer of a high frequency IC. SOLUTION: Tips of a plurality of probe needles 2 held by a holding member 3 is arranged around a substantially rectangular opening 7 disposed in the center of a printed-wiring board 1 so that the tips matches an electrode array such as an LSI chip as an inspected body. Through holes 4 are disposed on the printed-wiring board 1 correspondingly to the plurality of probe needles 2 on the rear end side of the probe needles 2, and the plurality of probe needles 2 are connected to a wiring pattern disposed on the printed-wiring board 1 via the through holes 4. Only the probe needles for a high frequency signal and a high frequency connector 5 are interconnected via the through-holes 4a used for a signal line by a microstrip line 6. COPYRIGHT: (C)2007,JPO&INPIT
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