| 摘要 |
PROBLEM TO BE SOLVED: To provide an implement for electroplating which can be recycled when a plurality of wafers each having the same size and the same shape are electroplated, which is easily adaptive to a change in the size or the like of the wafer and can uniformize the current density on one surface of the wafer to be electroplated to the utmost. SOLUTION: The implement for electroplating is a multilayer substrate 12 formed by layering substrates 12a, 12b, 12c and having metallic layers formed on both surfaces. In a wafer housing hole 14 formed in the multilayer substrate 12, a flange part 16 projected inward along the inside wall surface of the wafer housing hole14 is formed so that, when the wafer is housed in the wafer housing hole 14, the flange part 16 abuts on one surface side on the peripheral part of which a bus line for electroplating the wafer is formed and thus supports the wafer, and each of a plurality of pads 18 formed on one surface side of the flange part 16 and abutted on the electroplating bus line is electrically connected to the metallic layers forming both surfaces of the multilayer substrate 12. COPYRIGHT: (C)2007,JPO&INPIT
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