Connectorless electronic interface between rigid and compliant members using hemi-ellipsoidal surface features

摘要

A connectorless board-to-board, cable-to-board or cable-to-cable interconnect is presented. The interconnect is fashioned from solder beads or hemi-ellipsoidal surface structures on traces of a printed circuit board on one portion of the interconnect and contact pads on traces of a flexible interconnect media of a second portion of the interconnect or vice versa.