| 摘要 |
A ground wiring layer and a signal wiring layer are formed on a base insulating layer. A cover insulating layer is formed on the base insulating layer with an adhesive layer therebetween to cover the ground wiring layer and the signal wiring layer except for a certain region on the ground wiring layer. An electromagnetic shield layer is formed on the certain region of the ground wiring layer and the cover insulating layer. A resin solution is applied on a release sheet and dried, so that a transfer sheet including the resin layer and the release sheet is formed. Then, the surface of the resin layer is placed on the top surface of the electromagnetic shield layer and these layers are heated and pressurized, so that the transfer sheet is laminated on the electromagnetic shield layer. Thereafter, the release sheet is removed.
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