| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit wiring board which is densified by forming conductors without clearance on the circuit wiring board and to provide its manufacturing method. SOLUTION: The circuit wiring board has several first conductors 103 which are formed with clearances 108 one another on a conductor forming surface 102a of an insulating substrate 102, and first insulators 104 which are formed respectively on first exposed surfaces 103a of the first conductors 103. In this case, second conductors 105 are formed in the clearances 108 and second insulators 106 are formed on second exposed surfaces 105a of the second conductors 105 with fusing with the first insulators 104. COPYRIGHT: (C)2007,JPO&INPIT
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