KLEBSTOFF, KLEBSTOFFGEGENSTAND, SCHALTUNGSSUBSTRAT FÜR HALBLEITERMONTAGE MIT EINEM KLEBSTOFF UND EINE HALBLEITERANORDNUNG DIE DIESEN ENTHÄLT

摘要

An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt.%, a glass transition temperature of -10 DEG C or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.