| 摘要 |
A light emitting diode heat dissipation system is provided. The system typically includes a printed circuit board, a light emitting diode positioned adjacent the printed circuit board, and a heat sink positioned on an opposite side of the printed circuit board from the light emitting diode. The heat sink is typically configured to dissipate heat generated by the light emitting diode. The printed circuit board may include an opening formed intermediate the light emitting diode and the heat sink. The opening may be configured to facilitate heat transfer between a surface of the light emitting diode and a surface of the heat sink. Typically, at least one of the surface of the light emitting diode and the surface of the heat sink extends toward the opening in the printed circuit board.
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