发明名称 Apparatus and method for storing an electronic component, method for packaging electronic components and method for mounting an electronic component
摘要 An apparatus for storing an electronic component, the electronic component having a first surface and an opposite second surface, the apparatus includes a first film having a pocket that stores the electronic component and wherein the pocket has a protrusion at a bottom and wherein a top of the protrusion contacts with the second surface of the electronic component, and a second film covering the pocket and wherein a part of the second film is stuck to the first surface of the electronic component by a pressure difference so that the electronic component does not move freely.
申请公布号 US2006248714(A1) 申请公布日期 2006.11.09
申请号 US20060481181 申请日期 2006.07.06
申请人 发明人 KAWADA SEIICHI
分类号 H05K3/30;B23P19/00 主分类号 H05K3/30
代理机构 代理人
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