THERMOSETTING RESIN COMPOSITION

摘要

A thermosetting resin composition comprising a polyimide resin, an epoxy resin and an organic solvent wherein the polyimide resin is at least one polyimide resin obtained by imidization reaction of, as component (A), acid dianhydride mixture containing alkylene or phenylene bis(anhydrotrimellitate) (A1) and diphenylsulfonetetracarboxylic dianhydride (A2) with, as component (B), diamine mixture containing specified aromatic diamine (B1) and polyoxyalkylenediamine (B2) at a charging molar ratio of component (A) : component (B) = 1.01 to 1.20 : 1. Further, there are provided a thermosetting resin molding obtained by drying and curing of the composition; a cover coat ink for printed wiring board containing the composition; etc.