| 摘要 |
An electronic device comprises a plastic housing (2), height-structured metallic components (3) of a leadframe, and two line structures having a first line structure (9) with height-structured interconnects (11), and a second line structure (10) having bonding connections disposed within the plastic housing. An electronic device comprises: (i) a plastic housing having an underside; (ii) height-structured metallic components of a leadframe, and including contact islands (7) and chip islands in a matrix form on the underside of the plastic housing; and (iii) two line structures having a first line structure with height-structured interconnects disposed on the underside of the plastic housing with height-structured interconnects are further components of the height-structured metallic leadframe. The two line structures containing a second line structure having bonding connections disposed within the plastic housing. An Independent claim is also included for a method for producing an electronic device comprising: (a) providing a metallic carrier material comprising metal plate and a metal strip; (b) applying a mask on a top side of the metallic carrier material; (c) applying an etching stop layer to the uncovered areas of the metallic carrier material; (d) applying a height-structured layer to the etching stop layer in the uncovered areas of the metallic carrier material; and (e) removing the mask; (f) applying a bondable coating (25) to the contact islands; (g) applying a solderable coating and a conductive adhesive to the chip islands; (h) applying circuit elements to the chip islands; (i) producing bonding connections and line bridges between electrodes of the circuit elements and the contact islands and between the contact islands; (j) embedding the height-structured components, the circuit elements, an the bonding connections is a plastic molding compound (29) resulting in a one-sided packaging; (k) removing part of the height-structured leadframe at least as fast as the etching stop layer; (l) applying a structured insulating layer on an underside of the height-structured leadframe for covering undersides at least of the interconnects; and (m) separating the height-structured leadframe with the plastic molding compound into individual electronic devices. |
