Surface mountable semiconductor module has plastic housing having area in which ball sections of solder balls protrude out of socket contact surface

摘要

The module (1) includes a wiring substrate (3), solder balls (4) and a plastic housing (5). The plastic housing is arranged on the wiring substrate and includes a shaping (6). The plastic housing has an area (8) that is higher than another area (9). The solder balls in the area have ball sections that protrude out of a socket contact surface (11). An independent claim is also included for a semiconductor module manufacturing method.