摘要 |
A housing module (10, 40) for a circuit board comprises a first chamber (20, 50) for accommodating a main part of the circuit board and a second chamber (22, 52) bordering the first chamber (20, 50) and having a greater depth that the first chamber (20, 50) to enable it to accommodate a connector (16, 56) located along an edge of the circuit board and protruding above the surface of the circuit by an amount exceeding the depth of the first chamber (20, 50). The exterior of the module (10, 40) is shaped to enable two similar modules (10, 40) to be stacked with the first chambers (20, 50) overlying one another and with the second chambers (22, 52) circumferentially staggered around the stack, thereby and acting to maintain the modules of the stack in alignment with one another.
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