Multilayered printed wiring board and its manufacture

摘要

It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising an upper conductor circuit layer (6), a lower conductor circuit layer (5) and a resin insulating layer (2,3) electrically insulating both the conductor circuit layers, in which the resin insulating layer is a composite layer comprised of an insulating layer (2) made from a heat-resistant resin hardly soluble in acid or oxidizing agent as a lower layer and an adhesive layer (3) for electroless plating made from a heat-resistant resin as an upper layer.