BAKE MODULE OF TRACK COATER FOR SEMICONDUCTOR MANUFACTURING AND CLEANING METHOD

摘要

A bake module of track equipment for fabricating a semiconductor is provided to reduce a CD(critical dimension) difference between wafers in a photoresist coating apparatus having a plurality of bake modules for fabricating a semiconductor by including a cleaning unit in an exhaust line of the bake module. A wafer coated with photoresist for fabricating a semiconductor device is placed on a cylindrical hot plate. A heat unit heats the hot plate. The outer part of the hot plate is surrounded by a bake chamber whose upper part is open. The upper part of the bake chamber is covered with a disc-type cover part(30). An exhaust line(40) penetrates the center of the cover part. A cleaning nozzle(50) is installed in a position separated from a connection part of the disc-type cover part and the exhaust line.