发明名称 |
Silicone pressure-sensitive adhesive composition and pressure-sensitive adhesive tape |
摘要 |
<p>A pressure-sensitive adhesive tape having a cured layer of a silicone pressure-sensitive adhesive composition containing a phenolic antioxidant is attached to an adherend of metal, typically copper for bonding or masking purposes. Even after exposure to elevated temperatures of 150-250 DEG C, the tape can be smoothly peeled from the adherend without leaving any adhesive residue.</p> |
申请公布号 |
EP1295927(B1) |
申请公布日期 |
2006.11.08 |
申请号 |
EP20020256588 |
申请日期 |
2002.09.23 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
AOKI, SHUNJI |
分类号 |
C09J7/02;C09J183/04;C08K5/13;C08K5/134;C09J183/05;C09J183/07 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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