A ADHESIVE COMPOSITION FOR SEMICONDUCTER AND A ADHESIVE FILM USING THE SAME

摘要

Provided are an adhesive composition for adhering a die to a substrate in semiconductor packaging process which maintains the cohesion and adhesion within a suitable range and reduces the percent defective, and an adhesive film for packaging semiconductor using the composition. The adhesive composition comprises 100 parts by weight of a resin component which comprises 50-60 parts by weight of a solid epoxy resin, 20-40 parts by weight of a liquid epoxy resin and 1-20 parts by weight of polyacrylate; 20-30 phr of an organic filler; 5-10 phr of an inorganic filler; and 5-15 phr of a curing agent. The solid epoxy resin contains 90 wt% or more of a solid epoxy resin having a softening point of 60-160 deg.C.