发明名称 |
MULTILAYER PCB AND THE MANUFACTURING METHOD THEREOF |
摘要 |
A multi-layered printed circuit board and a method for manufacturing the same are provided to increase a space efficiency of a mounted component by installing decoupling capacitors in a substrate. Plural capacitors are built in an intermediate layer of a multi-layered printed circuit board, and are connected in parallel to each other along a desired electrode pattern. A first electrode(825) forms a pattern corresponding to arrangement of the capacitors so that the first electrode is electrically connected to a first terminal of the capacitor. A second electrode(840) is isolated from the first electrode, and has a pattern corresponding to the arrangement of the capacitors to connect with a second terminal of the capacitor.
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申请公布号 |
KR20060115284(A) |
申请公布日期 |
2006.11.08 |
申请号 |
KR20050037761 |
申请日期 |
2005.05.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI, DON CHEOL;LEE, DONG HWAN;YOON, HEE SOO |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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