发明名称 MULTILAYER PCB AND THE MANUFACTURING METHOD THEREOF
摘要 A multi-layered printed circuit board and a method for manufacturing the same are provided to increase a space efficiency of a mounted component by installing decoupling capacitors in a substrate. Plural capacitors are built in an intermediate layer of a multi-layered printed circuit board, and are connected in parallel to each other along a desired electrode pattern. A first electrode(825) forms a pattern corresponding to arrangement of the capacitors so that the first electrode is electrically connected to a first terminal of the capacitor. A second electrode(840) is isolated from the first electrode, and has a pattern corresponding to the arrangement of the capacitors to connect with a second terminal of the capacitor.
申请公布号 KR20060115284(A) 申请公布日期 2006.11.08
申请号 KR20050037761 申请日期 2005.05.04
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, DON CHEOL;LEE, DONG HWAN;YOON, HEE SOO
分类号 H05K3/46 主分类号 H05K3/46
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