| 摘要 |
PROBLEM TO BE SOLVED: To permit easy guarantee of the KGD (Known-Good-Die) of respective semiconductor chips to enable the manufacture of a semiconductor device under a high factor of non-defective unit and permit the utilization of the position, pitch, signal arrangement or the like of terminals of respective semiconductor chips as they are without restraining them, upon constituting one set of packaged semiconductor device by incorporating a plurality of semiconductor chips thereinto. SOLUTION: A projection provided on a semiconductor chip mount sealing sub substrate 100 is bonded onto the package substrate 10. Semiconductor bear chips 31, 32 are arranged in a space formed between the semiconductor chip mount sealing sub substrate 100 and the package substrate 10 to permit wiring. COPYRIGHT: (C)2006,JPO&NCIPI |
