发明名称 |
Solder for use on surfaces coated with nickel by electroless plating |
摘要 |
A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60-64 mass % of Sn, 0.002-0.01 mass % of P, 0.04-0.3 mass % of Cu, and a remainder of Pb. The solder is particularly suitable for forming a solder bump on a Cu electrode which has been coated with Ni by electroless plating.
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申请公布号 |
US7132020(B2) |
申请公布日期 |
2006.11.07 |
申请号 |
US20030668377 |
申请日期 |
2003.09.24 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
NOZAWA IWAO;HORI TAKASHI;SOMA DAISUKE;ROPPONGI TAKAHIRO |
分类号 |
B23K1/00;B23K35/24;B23K35/02;B23K35/26;B32B15/01;C22C13/00;H01L23/12;H05K3/24;H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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