发明名称 |
Method of forming a layered polishing pad |
摘要 |
A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.
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申请公布号 |
US7132033(B2) |
申请公布日期 |
2006.11.07 |
申请号 |
US20040788951 |
申请日期 |
2004.02.27 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
BOLDIZAR MARK J.;GAMBLE ROBERT T.;HEDRICK VINCENT MATTHEW;LAWHORN JASON M.;SAIKIN ALAN H.;TOME KATHERINE L. |
分类号 |
B24B37/00;B32B37/02;B24B37/04;B24B49/12;B24D7/12;B24D18/00;B32B37/12;B32B38/04;B32B38/10;B32B38/18;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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