发明名称 Method of fabricating a compound semiconductor layer
摘要 A method of fabricating a compound semiconductor layer has steps of forming a first layer made of an oxidizable material on a substrate, forming a second layer made of a compound semiconductor on the first layer, oxidizing the first layer made of the oxidizable material to an oxide layer and forming a third layer made of compound semiconductor that constitutes a semiconductor element on the second layer.
申请公布号 US7132351(B2) 申请公布日期 2006.11.07
申请号 US20040897915 申请日期 2004.07.23
申请人 ROHM CO., LTD. 发明人 SAI HIRONOBU
分类号 H01L21/36;H01L29/201;C30B25/18;C30B29/40;H01L21/20;H01L21/205;H01L21/762;H01S5/323 主分类号 H01L21/36
代理机构 代理人
主权项
地址