| 摘要 |
<p>Provided are an adhesive composition for semiconductor which is reduced in the over-flow of resin components and the generation of burr in case of cutting, and an adhesive film for packaging semiconductor using the composition which reduces the percent defective of a semiconductor chip. The adhesive composition comprises a base resin which is at least one selected from a polyimide resin, an epoxy resin, an acrylic resin and a urethane resin; 5-40 wt% of an organic filler which is at least one selected from a carboxyl-terminated butadiene acrylonitrile rubber (CTBN), an epoxy-terminated butadiene acrylonitrile rubber (ETBN), an amine-terminated butadiene acrylonitrile rubber (ATBN) and a core-shell rubber; and 0.2-20 wt% of an inorganic filler which is at least one selected from fumed silica, titanium dioxide, barium sulfate, alumina, aluminum nitride, boron nitride, silicate, aluminum hydroxide and calcium carbonate. The adhesive composition is dispersive, a particle constituting the dispersion has an average particle size of 10 micrometers or less, and the dispersion contains 30 % or less of a particle having an average particle size of 5 micrometers or more based on the total area of the dispersion.</p> |
