发明名称 |
Test apparatus having intermediate connection board for package |
摘要 |
A test apparatus may include a test socket having socket pins with a standard configuration. An intermediate connection board may be interposed between the test socket and a package that has solder balls with a non-standard configuration. The intermediate connection board may have contact balls and contact pads. The contact balls may be arranged in a configuration that is compatible with the standard socket pin configuration, and the contact pads may be arranged in a configuration that is compatible with the non-standard solder ball configuration.
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申请公布号 |
US7131847(B2) |
申请公布日期 |
2006.11.07 |
申请号 |
US20040001182 |
申请日期 |
2004.12.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JONG-JOO |
分类号 |
H01L21/66;H01R12/00;H01R13/24;H05K1/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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