发明名称 Package for electronic component and method of manufacturing piezoelectric device
摘要 Aspects of the invention provide a package for accommodating a piezoelectric resonator that can include more mounting electrodes than connecting electrodes of the piezoelectric resonator element. The mounting electrodes can be electrically connected with a wiring pattern. In the lower surface of a package body, there can be formed external terminals at the four corners thereof. The external terminals are bonded to a mounting board. The external terminals are electrically connected to the mounting electrodes, respectively. The external terminal is not connected electrically to either of the mounting electrodes. Therefore, positions of the external terminals for operating the piezoelectric resonator can be changed based on whether a pair of connecting electrodes of the piezoelectric vibration element is bonded to the mounting electrodes, or it is connected to the mounting electrodes. Accordingly, it can be possible to easily change positions of external terminals for connecting to a circuit on a board.
申请公布号 US7132737(B2) 申请公布日期 2006.11.07
申请号 US20050041253 申请日期 2005.01.25
申请人 SEIKO EPSON CORPORATION 发明人 MIYAZAKI KATSUHIKO
分类号 H01L23/02;H01L23/04;H01L41/04;H01L41/08;H01L41/18;H02N2/00;H03B5/32;H03H3/02;H03H9/02;H03H9/05;H03H9/10;H03H9/15 主分类号 H01L23/02
代理机构 代理人
主权项
地址