Memory stack package and Method for manufacturing thereof,申请号KR20050002540-传众专利搜索

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发明名称	Memory stack package and Method for manufacturing thereof
摘要
申请公布号	KR100641625(B1)	申请公布日期	2006.11.06
申请号	KR20050002540	申请日期	2005.01.11
申请人		发明人
分类号	H01L23/50;H01L21/60	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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