| 摘要 |
Disclosed is a surface treating method wherein the surface of a base (11) exposed between multilayer films (13) is processed with a plasma (28) while a patterned metal wiring layer (15) is not exposed to the plasma (28) since a wiring board (10) is exposed to the plasma (28) with the patterned metal wiring layer (15) covered with a protective layer (18). Consequently, in cases where the metal wiring layer (15) is composed of copper, a copper nitrate is not formed on the surface of the metal wiring layer (15) even when the atmosphere comes into the space where the plasma is generated. The metal wiring layer (15) is thus prevented from deterioration, and a highly reliable electrical device can be obtained by connecting a wiring board (10) treated by such a surface treating method to an electrical component.
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