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发明名称
Wafer polishing pad and Method of manufacturing the same
摘要
申请公布号
KR100642423(B1)
申请公布日期
2006.11.03
申请号
KR19990065175
申请日期
1999.12.29
申请人
发明人
分类号
H01L21/304
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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