| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition effectively used as a sealing material for an optical semiconductor element because of high transparency and high hardness without corrosiveness for metals and excellent preservation stability of the resin. <P>SOLUTION: The resin composition for sealing the optical semiconductor element is an addition curing type silicone resin composition comprising (A) an organosilicon compound, (B) an organohydrogenpolysiloxane and (C) a platinum catalyst as essential components. (A) The organosilicon compound contains an organopolysiloxane represented by average compositional formula (1) (R<SP>1</SP>SiO<SB>3/2</SB>)<SB>a</SB>(R<SP>2</SP>R<SP>3</SP>SiO)<SB>b</SB>(R<SP>4</SP>R<SP>5</SP>R<SP>6</SP>SiO<SB>1/2</SB>)<SB>c</SB>(SiO<SB>4/2</SB>)<SB>d</SB>(1) (wherein, R<SP>1</SP>to R<SP>6</SP>are each a monofunctional hydrocarbon group and 1-50 mol% is a non-covalent bonding double bond-containing group; a+b+c+d=X is 1.0; a/X is 0.40-0.95; b/X is 0.05-0.60; c/X is 0-0.05; and d/X is 0-0.10) and has a non-covalent bonding double bond group. In the composition, the organopolysiloxanes of the components (A) and (B) contain no silanol. <P>COPYRIGHT: (C)2007,JPO&INPIT |
