| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film that retains heat resistance and flexibility each at a higher level and causes no film warpage after a heat treatment, and a composite film having an adhesive layer, a composite film having a metal thin film layer and a composite film having a non-metal thin film layer each obtained using the polyimide film as a substrate. SOLUTION: The polyimide film is composed of a polyimide comprising at least a pyromellitic acid residue as an aromatic tetracarboxylic acid residue and a diaminodiphenyl ether residue as an aromatic diamine residue, and has a curl degree of more than 10% at 300°C. The composite film having an adhesive layer, the composite film having a metal thin film layer and the composite film having a non-metal thin film layer are each obtained using the polyimide film as a substrate. COPYRIGHT: (C)2007,JPO&INPIT |
