发明名称 SUBSTRATE FOR FLEXIBLE PRINT CIRCUIT
摘要 PROBLEM TO BE SOLVED: To enhance adhesion between a sheet-like substrate made of an aromatic polyamide and a thin-film layer of copper. SOLUTION: In the substrate for flexible print circuit, corona discharge processing is performed on the surface of a sheet-like substrate, composed of aromatic polyamide under specified conditions. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006303208(A) 申请公布日期 2006.11.02
申请号 JP20050123210 申请日期 2005.04.21
申请人 TEIJIN LTD 发明人 YOSHITOMI TAKASHI
分类号 H05K3/38;H05K1/03;H05K1/09 主分类号 H05K3/38
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