| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of exchanging lamps of a lamp type RTP device, without releasing a chamber, in a short time. SOLUTION: A heat treatment apparatus 1 is provided with a chamber 3 in which a semiconductor substrate 10 is arranged almost horizontally. The upper wall surface of the chamber 3 consists of a transparent window 36 of a translucent material which is almost parallel to the semiconductor substrate 10 arranged in the inside. A lamp unit 2, arranged on the transparent window 36, comprises a plurality of lamps 21 that are arrayed in the plane almost parallel to the transparent window 36 for heating the semiconductor substrate 10 arranged in the chamber 3 through the transparent window 36 from the outside of the chamber 3, and a condensing means 22, which is arranged around the lamps 21 to condense the light radiated from the lamps 21 toward the transparent window. The apparatus also comprises a coming-off preventing means which prevents the condensing means 22 arranged around the lamps 21 from coming off the lamps 21, when the lamp unit 2 detaches from the transparent window 36. COPYRIGHT: (C)2007,JPO&INPIT
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