| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum film deposition apparatus capable of reliably retaining a substrate and suppressing unbalance of the film thickness distribution, and a vacuum film deposition method. SOLUTION: The vacuum film deposition apparatus 16 comprises an electrostatic chuck 34 to retain a substrate 18, a vacuum chamber 32 having an adsorption chamber 32b where the substrate 18 is attracted to the electrostatic chuck 34 and a film deposition chamber 32a provided adjacent to the adsorption chamber 32b to perform the film deposition on the substrate 18, and an arm member 36 which horizontally moves the electrostatic chuck 34 in an X-axis direction, and moves the electrostatic chuck 34 in a Y-axis direction in the film deposition chamber 32a. COPYRIGHT: (C)2007,JPO&INPIT
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