| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating method where the film thickness of an electroplating layer can be uniformized, and to provide an electroplating line. SOLUTION: In the electroplating method, a process where an object to be plated is held to a holder, and a process where the object is dipped into a plating liquid are performed. Further, a negative voltage is applied to the object via the holder, positive voltage is applied to a positive electrode arranged inside the plating liquid, and, further, as the holder is rotated to a prescribed direction together with the object, an electroplating layer is formed on the surface of the object. By applying the electroplating treatment while the rotation is performed, the plating layer with a uniform film thickness can be formed. COPYRIGHT: (C)2007,JPO&INPIT
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