发明名称 |
RESIN COMPOSITION FOR DIRECT PLATING AND PLATED ORNAMENTAL PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for direct plating having excellent balance between plating deposition properties and plating adhesion strength in the electric copper plating process of PC/ABS type resins in the direct plating method and excellent impact and heat resistance and resin performance. SOLUTION: The composition comprises (A) 20-80 wt.% of a polycarbonate resin and (B) 80-20 wt.% of a rubber-reinforced styrene type resin. The rubber-reinforced styrene type resin (B) consists of (b-1) a rubber-reinforced styrene type resin produced by emulsion polymerization and (b-2) a rubber-reinforced styrene type resin produced by bulk and/or solution polymerization. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2006299089(A) |
申请公布日期 |
2006.11.02 |
申请号 |
JP20050122798 |
申请日期 |
2005.04.20 |
申请人 |
NIPPON A & L KK |
发明人 |
FUJIWARA TAKAYOSHI;TOYOTAKA TATSUJI;NAKAJIMA YASUSHI |
分类号 |
C08L69/00;C08J7/06;C08L51/04;C25D5/56;C25D7/00 |
主分类号 |
C08L69/00 |
代理机构 |
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地址 |
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