发明名称 RESIN COMPOSITION FOR DIRECT PLATING AND PLATED ORNAMENTAL PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for direct plating having excellent balance between plating deposition properties and plating adhesion strength in the electric copper plating process of PC/ABS type resins in the direct plating method and excellent impact and heat resistance and resin performance. SOLUTION: The composition comprises (A) 20-80 wt.% of a polycarbonate resin and (B) 80-20 wt.% of a rubber-reinforced styrene type resin. The rubber-reinforced styrene type resin (B) consists of (b-1) a rubber-reinforced styrene type resin produced by emulsion polymerization and (b-2) a rubber-reinforced styrene type resin produced by bulk and/or solution polymerization. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006299089(A) 申请公布日期 2006.11.02
申请号 JP20050122798 申请日期 2005.04.20
申请人 NIPPON A & L KK 发明人 FUJIWARA TAKAYOSHI;TOYOTAKA TATSUJI;NAKAJIMA YASUSHI
分类号 C08L69/00;C08J7/06;C08L51/04;C25D5/56;C25D7/00 主分类号 C08L69/00
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