ABRASIVE PAD, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide an abrasive pad and a manufacturing method therefor which pad has abrasive characteristics superior to that of a conventional abrasive pad and does not contain halogen, and to provide a manufacturing method for a semiconductor device that uses the abrasive pad.

SOLUTION: The abrasive pad has an abrasive layer, made of a polyurethane resin foam which is selected from among a fatty and/or alicyclic isocyanate end prepolymer and a group of compounds, represented by general Formulas (1) to (3). The polyurethane resin foam is a hardened material, resulting from reaction with a chain elongating agent containing at least one kind of non-halogen-based aromatic amine.

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