WAFER DELIVERY DEVICE, POLISHING UNIT, AND WAFER RECEIVING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wafer delivery device which is capable of shortening a necessary time in a wafer delivery process until a wafer held by a top ring (wafer holding mechanism) is released and seated on a pusher mechanism (wafer delivery mechanism).

SOLUTION: The wafer delivery device is equipped with the top ring 60 which holds the wafer W and the pusher mechanism 10 which exchanges the wafers W with the top ring 60. The pusher mechanism 10 is equipped with a wafer tray 40 where the wafer W is placed and configured so as to seat the wafer W released from the lower end surface of the top ring 10 on the wafer tray 40, and the pusher mechanism 10 is equipped with a sensing mechanism 50 which detects that the wafer W is seated right on the wafer tray 40. The sensing mechanism 50 has a configuration wherein a sensing beam emitted from a light projecting unit 51 is blocked by the wafer W seated on the wafer tray 40.

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