| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate pad having minute pitches. <P>SOLUTION: A flip chip method, utilizing gold bumps and ink jet printing, is displayed. The flip-chip method comprises a step for forming the gold bumps in a semiconductor chip, a step for printing solder ink on a first pad of a substrate by using ink jet printing, a step for mounting the semiconductor chip on the substrate for bringing the gold bumps into contact with solder ink and a step for making the substrate reflow. Since process cost and process times can be reduced, the semiconductor chip, having the detailed pitches can be mounted on the substrate and solder resist, is not required to be formed, substrate pad having detailed pitches can be realized. <P>COPYRIGHT: (C)2007,JPO&INPIT |
