| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which outflow of liquid material can be prevented when a semiconductor element is mounted on a substrate using a liquid ejection method. SOLUTION: The semiconductor device S is equipped with a wall portion 18 provided on the circuit surface 2A of a semiconductor element 2 including the surface 3A of a connection terminal 3 and surrounding the surface 3A of a connection terminal 3 on the outside thereof. COPYRIGHT: (C)2007,JPO&INPIT |
