| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip system in which surfaces of LSI chips are stuck to each other on a package substrate, wherein the malfunctions of a circuit due to electrical coupling with a micro signal circuit in the LSI chip, facing a package substrate wiring, will not occur. SOLUTION: At an LSI design phase, a region indicating the circuit treating the micro signal is created as a region pattern, excluding a wiring. The coordinates of the region pattern, excluding the wiring in a state with the LSI chips flipped, are computed and recognized by a substrate design tool. When the substrate wiring is designed by the substrate design tool, by making the wiring not to perform in the recognized region excluding the wiring, the electrical coupling of the substrate wiring with the micro signal circuit is restrained, and the malfunctions of the circuit is prevented. COPYRIGHT: (C)2007,JPO&INPIT
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