发明名称 Heat-dissipation device and electronic apparatus utilizing the same
摘要 An electronic apparatus and a heat-dissipation device thereof. The electronic apparatus includes a plate and the heat-dissipation device. The plate includes a first component and a second component thereon. The heat-dissipation device is adjacent to the plate, and includes a first sensor, a first cooling component, a second sensor, and a second cooling component thereon. The first sensor measures the temperature of the plate around the first component. The first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component. The second sensor measures the temperature of the plate around the second component. The second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.
申请公布号 US2006242966(A1) 申请公布日期 2006.11.02
申请号 US20060413703 申请日期 2006.04.28
申请人 BENQ CORPORATION 发明人 WANG BANG J.;LI CHANG C.;LIAO KELVIN
分类号 F25B21/02;F25D23/12 主分类号 F25B21/02
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